Electronic Packaging Engineer

Job opening ID
2346

Posting title
Electronic Packaging Engineer

Roles and responsibilities
18 month contract position
W2 with full benefits
Customer and contract specific training will be required and provided.


Job Description:
•Serve as an Electronic Packaging Engineer under the lead packaging engineer for JPL flight project.
•Work in a collaborative environment to design, analyze, build and test of the electromechanical subsystem or system on JPL flight projects.
•Interface with electrical engineers, system mechanical engineers, Manufacturing engineers for machine shop and electronic fabrication, quality
assurance engineers to develop solutions to resolve discrepancies with hardware fabrication.
•Define and scope tasks and acquire resources to complete a task on time and budget.
•Lead teams in a collaborative environment to design, analyze, develop support equipment for the project and research applications.
•Lead design reviews.
•Interface with engineers, designers, analysts, machine shop, and project staff.
•Work independently and under the direction of the group supervisor, project management, technical leads, and proposal managers as required.


Required Skills:
•Must be a US Citizen or Green Card Holder
•Offer contingent on ability to successfully pass a background check and drug screen
•Bachelor’s degree in Mechanical Engineering or related technical discipline with a minimum of 3 years of related experience; Masters degree in similar disciplines with a minimum of 1year of related experience; PhD with 0 years of related experience.
•Practical experience in using advanced application of principles, theories, concepts and techniques in mechanical design, ability to solve packaging engineering mechanical design problems, perform trade studies, develop design requirements, perform piece part design and coordinate fabrication, assembly, and qualification of hardware.
•Practical experience in using computer aided engineering (CAD) using tools such as Unigraphics NX, Solidworks, AutoCad.
•Knowledge of Standards for Geometric Dimensioning and Tolerancing (GD&T) per American Society of Mechanical Engineers (ASME) Y14.5.
•Practical knowledge of applicable industry and/or academic practices and standards in mechanical systems including structures, configuration, electronic packaging, techniques in soldering operations, surface mount technology electronics manufacturing, thermal and structural analysis, and integration and test.
•Advanced knowledge in one or more related fields of the following areas: design of printed wiring boards and electronic enclosure/chassis, manufacturing and assembly of printed wiring boards and cable harnesses.
•Advanced understanding and application of standard principles, theories, concepts and techniques in soldering operations, cable assembly and surface mount technology electronics manufacturing.
•Practical knowledge of design, build, assembly and test (IBAT) process.
•Advanced written and verbal communication skills and organizational skills.
•Must be able to work in a team environment and meet deadlines.

Desired Skills:
•Broad knowledge of applicable Laboratory policies and procedures, NASA policies and procedures, and government regulations.
•Broad knowledge in Mechanical Analysis tool (FEM).
•Experienced with spacecraft flight hardware development and test.
•Experienced with Printed Wiring Board (PWB) design tools such as Mentor or Altium.
•Experienced with packaging design, assembly and test.
•Desire a candidate who is assertive, self-motivated and can work with minimal direction.
•Working Knowledge of the JPLdrawing release process and inspection reports.
•Working knowledge of the JPL Instruction, build, assembly and test ( iBAT) process.
•Working knowledge in Unigraphics NX or Solidworks.


Number of positions
1

Location
Pasadena

State
California