Mechanical Engineer I

Job opening ID
3161

Posting title
Mechanical Engineer I

Roles and responsibilities
Must be a US Citizen or Green Card Holder
Estimated duration of 18 months with the potential for extension or conversion.
W2 with full benefits
Customer and contract specific training will be required and provided.
Labor Category: Mechanical Engineer I

Job Description:
An Electronic Packaging Engineers at JPL play a central role in every project, large and small. Given the sheer scope and aspirations of our work, you’re always part of “building the impossible."" This unique position lies at the intersection of multi-disciplinary (electrical, mechanical, materials and thermal management engineering) on a complex, one of a kind electronic system. You will be a member of the Electronic Packaging Engineering Group and will report to group supervisor within the JPL's Electronic Manufacturing, Packaging & Technical Services Section Some challenges you will tackle:
• Generate 3-D Modeling, design and design updates, and drawings for spacecraft and instrument electronics subsystem and Ground Support Equipment.
• Perform electro-mechanical analyses such as thermal, structural and venting analyses for the subsystem.
• Coordinate, Collaborate and interface with machine shop for delivery of mechanical hardware.
• Partnering, Interfacing and Collaborating with Quality Assurance to develop solutions to resolve discrepancies with hardware fabrication.
• Prepare for technical design and manufacturing status review presentations, and close the reviews action items.
• May have some interactions with customers or lead own design peer reviews or participate in design reviews.

Required Skills:
• Must be a US Citizen or Green Card Holder
• Offer contingent on ability to successfully pass a background check and drug screen
• Bachelor's, Master's, or PhD degree in Mechanical, Aerospace, Electrical Engineering or related major.
• Minimum of a 3.0/4.0 cumulative GPA.

Desired Skills:
Experience in JPL summer or academic part-time internship
Experience working with Unigraphics NX.
Some knowledge in Mechanical Analysis tool (FEM).
Some knowledge in Printed Wiring Board (PWB) design layout tools such as Mentor or Altium.
Understanding of the standard principles, theories, concepts and techniques of electronic packaging engineering


Number of positions
1

Location
Pasadena

State
California